Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Patent
1994-01-19
1995-12-26
Dang, Thi
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With microwave gas energizing means
20429806, 20429808, 20429809, 20429815, 20429834, 20429803, 20429832, 118723E, 118724, 118728, 216 61, 216 71, H05H 100
Patent
active
054784298
ABSTRACT:
The present invention provides a plasma process apparatus wherein RF power is applied to a process gas, thereby to convert the gas into plasma for processing an object, the apparatus having a process chamber, an upper electrode located in the process chamber and having a gas-supplying section for supplying a process gas, a lower electrode located in the process chamber, having a cooling means, and opposing the upper electrode, for supporting an object, and RF power supplying means electrically connected to the lower electrode, protruding from the process chamber and connected to a RF power supply, for supplying RF power between the upper and lower electrodes, wherein the RF power supplying means includes, an outer conductive pipe surrounding the inner conductive rod and spaced therefrom, and a fixing member inserted between the inner conductive rod and the outer conductive pipe and having concaves and convexes, the inner conductive rod and the outer conductive pipe being electrically connected to an RF power supply source.
REFERENCES:
patent: 4808258 (1989-02-01), Otsubo et al.
patent: 5195045 (1993-03-01), Keane et al.
patent: 5223457 (1993-06-01), Mintz et al.
patent: 5228940 (1993-07-01), Yoneda
patent: 5342471 (1994-08-01), Fukasawa et al.
Deguchi Youichi
Kawakami Satoru
Komino Mitsuaki
Ueda Yoichi
Dang Thi
Tokyo Electron Limited
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