Plasma etching apparatus

Details Plasma etching apparatus Plasma etching apparatus

2011-05-31

2011-05-31

Hassanzadeh, Parviz (Department: 1716)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

Having glow discharge electrode gas energizing means

C118S715000, C118S7230ER, C118S7230AN, C156S345300, C156S345440, C156S345450, C156S345460, C156S345470

Reexamination Certificate

active

07951261

ABSTRACT:
The present invention relates to a plasma etching apparatus. In the apparatus, potential difference is applied between a substrate support with a substrate seated thereon and a electrode surrounding an edge region of the substrate, and a distance between the substrate and the electrode is set to 3 mm or less so as to locally generate plasma in an area between the substrate and the electrode, thereby removing particles and a thin film in the edge region of the substrate.

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