Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2001-02-28
2002-03-26
Nelms, David (Department: 2818)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S637000
Reexamination Certificate
active
06362098
ABSTRACT:
FIELD OF THE INVENTION
The present invention generally relates to semiconductor manufacturing, and, more particularly, to chemical vapor deposition (CVD).
BACKGROUND OF THE INVENTION
Electronic circuits are manufactured from semiconductor substrates (“wafers”) that are processed in a variety of steps such as, for example, lithography, etching, CVD, chemical-mechanical polishing (CMP). In some processing steps, dielectric material is deposited into trenches at the substrate surface. There is a continuous desire to perform the deposition uniform and free of so-called voids. The present invention seeks to provide an improved deposition method.
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Breeden Terry Alan
Mautz Karl Emerson
Shahvandi Iraj Eric
Tucker Michael Thomas
Vatel Olivier Gerard Marc
Dang Phuc T.
King Robert L.
Motorola Inc.
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