Plasma enhanced atomic layer deposition system and method

Details Plasma enhanced atomic layer deposition system and method Plasma enhanced atomic layer deposition system and method

2005-03-21

2008-10-14

Meeks, Timothy (Department: 1792)

Coating processes

Direct application of electrical, magnetic, wave, or...

Plasma

C427S575000, C427S576000, C427S577000, C427S578000

Reexamination Certificate

active

07435454

ABSTRACT:
A method for depositing a film on a substrate using a plasma enhanced atomic layer deposition (PEALD) process includes disposing the substrate in a process chamber configured to facilitate the PEALD process, introducing a first process material within the process chamber and introducing a second process material within the process chamber. Electromagnetic power is coupled to the process chamber during introduction of the second process material in order to generate a plasma that facilitates a reduction reaction between the first and second process materials at a surface of the substrate, electromagnetic power is coupled to a gas injection electrode to generate a plasma that ionizes contaminants such that the ionized contaminants are attracted to a plurality of orifices in the gas injection electrode. The process chamber is vacuum pumped through the plurality of orifices to expel the ionized contaminants from the process chamber.

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