Plasma-assisted vapor phase treatment of low dielectric...

Details Plasma-assisted vapor phase treatment of low dielectric... Plasma-assisted vapor phase treatment of low dielectric...

2011-03-08

2011-03-08

Barr, Michael (Department: 1711)

Coating processes

Direct application of electrical, magnetic, wave, or...

Plasma

C434S410000, 43, C250S492210, C438S781000, C438S758000, C438S759000, C438S760000, C438S623000, C438S638000, C428S426000, C427S255280, C427S058000, C427S096100

Reexamination Certificate

active

07901743

ABSTRACT:
A method and system for treating a dielectric film on a plurality of substrates includes disposing the plurality of substrates in a batch processing system, the dielectric film on the plurality of substrates having a dielectric constant value less than the dielectric constant of SiO2. The plurality of substrates are heated, and a treating compound comprising a CxHycontaining compound, wherein x and y represent integers greater than or equal to unity is introduced to the process system. A plasma is formed and at least one surface of the dielectric film on said plurality of substrates is exposed to the plasma.

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patent: 2004-343017 (2004-12-01), None

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