Planarization method of manufacturing a superjunction device

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S389000, C438S561000, C438S700000, C257SE21551

Reexamination Certificate

active

11009616

ABSTRACT:
A method of manufacturing a semiconductor device includes providing a substrate having first and second main surfaces. The substrate has a heavily doped region of a first conductivity at the second main surface and has a lightly doped region of the first conductivity at the first main surface. The method includes providing trenches and mesas in the substrate, implanting, at an angle, a dopant of the first conductivity into a sidewall of a mesa and implanting, at an angle, a dopant of a second conductivity into the mesa at another sidewall. The method includes oxidizing the sidewalls and bottoms of each trench and tops of the mesas to create a top oxide layer, etching back the top oxide layer to expose a portion of the mesa, depositing an oxide layer to cover the etched back top layer and mesa and planarizing the top surface of the device.

REFERENCES:
patent: 4158206 (1979-06-01), Neilson
patent: 4895810 (1990-01-01), Meyer et al.
patent: 5019522 (1991-05-01), Meyer et al.
patent: 5045903 (1991-09-01), Meyer et al.
patent: 5216275 (1993-06-01), Chen
patent: 5366914 (1994-11-01), Takahashi et al.
patent: 5435888 (1995-07-01), Kalnitsky et al.
patent: 5472888 (1995-12-01), Kinzer
patent: 5506421 (1996-04-01), Palmour
patent: 5598018 (1997-01-01), Lidow et al.
patent: 5742087 (1998-04-01), Lidow et al.
patent: 5744994 (1998-04-01), Williams
patent: 5786619 (1998-07-01), Kinzer
patent: 5902127 (1999-05-01), Park
patent: 5929690 (1999-07-01), Williams
patent: 5939754 (1999-08-01), Hoshi
patent: 6081009 (2000-06-01), Neilson
patent: 6136652 (2000-10-01), Hazani
patent: 6184555 (2001-02-01), Tihanyi et al.
patent: 6190970 (2001-02-01), Liao et al.
patent: 6198127 (2001-03-01), Kocon
patent: 6214698 (2001-04-01), Liaw et al.
patent: 6222229 (2001-04-01), Herbert et al.
patent: 6239463 (2001-05-01), Williams et al.
patent: 6265281 (2001-07-01), Reinberg
patent: 6291856 (2001-09-01), Miyasaka et al.
patent: 6300171 (2001-10-01), Frisina
patent: 6307246 (2001-10-01), Nitta et al.
patent: 6359309 (2002-03-01), Liao et al.
patent: 6362505 (2002-03-01), Tihanyi
patent: 6391723 (2002-05-01), Frisina
patent: 6410958 (2002-06-01), Usi et al.
patent: 6452230 (2002-09-01), Boden, Jr.
patent: 6459124 (2002-10-01), Tihanyi
patent: 6465325 (2002-10-01), Ridley et al.
patent: 6495421 (2002-12-01), Luo
patent: 6501130 (2002-12-01), Disney
patent: 6501146 (2002-12-01), Harada
patent: 6504230 (2003-01-01), Deboy et al.
patent: 6509220 (2003-01-01), Disney
patent: 6635906 (2003-10-01), Chen
patent: 6710403 (2004-03-01), Sapp
patent: 7023069 (2006-04-01), Blanchard
patent: 7041560 (2006-05-01), Hshieh
patent: 2002/0070418 (2002-06-01), Kinzer et al.
patent: 2002/0149051 (2002-10-01), Kinzer et al.
patent: 2005/0176192 (2005-08-01), Hshieh
patent: 2005/0181558 (2005-08-01), Hshieh
patent: 2005/0181577 (2005-08-01), Hshieh
patent: 2006/0160309 (2006-07-01), Hshieh
patent: 2006/0252219 (2006-11-01), Hshieh

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Planarization method of manufacturing a superjunction device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Planarization method of manufacturing a superjunction device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Planarization method of manufacturing a superjunction device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3801249

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.