Photosensitive resin composition for sandblast resist

Details Photosensitive resin composition for sandblast resist Photosensitive resin composition for sandblast resist

1998-02-04

1999-06-29

Duda, Kathleen

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Forming nonplanar surface

451 31, 216 52, G03F 700

Patent

active

059167386

ABSTRACT:
Disclosed is a photosensitive resin composition suitable as a resist material against sandblasting for pattern-wise engraving of the surface of a body after photolithographic patterning, which comprises: (a) a urethane compound having a (meth)acrylate group at the molecular end, which is obtained from a polyether or polyester compound having a hydroxy group at the molecular chain end, a diisocyanate compound and a (meth)acrylate compound having a hydroxy group; (b) an alkali-soluble polymeric compound having an acid value in the range from 50 to 250 mg KOH/g; and (c) a photopolymerization initiator.

REFERENCES:
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patent: 4764449 (1988-08-01), Vanlseghem
patent: 5541479 (1996-07-01), Nagakubo
patent: 5763139 (1998-06-01), Matsunaga et al.

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