Photosensitive resin composition and method of forming conductiv

Details Photosensitive resin composition and method of forming conductiv Photosensitive resin composition and method of forming conductiv

1993-09-20

1996-04-09

Dote, Janis L.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Forming nonplanar surface

430311, 430315, 4302701, 430325, 430327, 430330, 427 98, 427229, 427305, 427510, G03C 558, G03F 730

Patent

active

055060919

ABSTRACT:
A photosensitive resin composition formed by dissolving a photosensitive resin and a metallic salt or a metal complex in a common solvent or by dispersing reduced metal colloid particles in a photosensitive resin. Also disclosed is a method of forming electrically conductive patterns by applying the photosensitive resin composition to a substrate, pre-baking the resin and then successively subjecting it to exposure, development and post-baking. The result is subjected to electroless plating, directly in the case of the photosensitive resin containing dispersed metal colloid particles, and after reducing the metallic salt or a metal complex to a metal in the case of the photosensitive resin composition containing a metallic salt or metal complex. The reduction of the metallic salt or metal complex is conducted after pre-baking or one of the ensuing steps.

REFERENCES:
patent: 3779758 (1973-12-01), Polichette
patent: 3900320 (1975-08-01), Rolker et al.
patent: 3904784 (1975-09-01), Nara et al.
patent: 4948707 (1990-08-01), Johnson et al.
patent: 4981715 (1991-01-01), Hirsch et al.
patent: 5045436 (1991-09-01), Tieke et al.
Anonymous Disclosure, Research Disclosures, Dec. 1973, pp. 30-31.

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