Photoresist topcoat for a photolithographic process

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Forming nonplanar surface

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C430S326000, C430S270100, C430S330000, C430S331000, C430S272100, C430S273100, C430S271100

Reexamination Certificate

active

07910290

ABSTRACT:
A method of forming an image using a topcoat composition. A composition that includes functionalized polyhedral oligomeric silsesquioxanes derivatives of the formulas TmR3where m is equal to 8, 10 or 12 and QnMnR1,R2,R3where n is equal to 8, 10 or 12 are provided. The functional groups include aqueous base soluble moieties. Mixtures of the functionalized polyhedral oligomeric silsesquioxanes derivatives are highly suitable as a topcoat for photoresist in photolithography and immersion photolithography applications.

REFERENCES:
patent: 5733714 (1998-03-01), McCulloch et al.
patent: 6632582 (2003-10-01), Kishimura et al.
patent: 6783917 (2004-08-01), Blakeney et al.
patent: 6936663 (2005-08-01), Modisette
patent: 6969577 (2005-11-01), Adegawa
patent: 7041748 (2006-05-01), Lin et al.
patent: 7141692 (2006-11-01), Allen et al.
patent: 7306853 (2007-12-01), Lin et al.
patent: 2002/0090572 (2002-07-01), Sooriyakumaran et al.
patent: 2002/0127416 (2002-09-01), Hacker
patent: 2002/0136910 (2002-09-01), Hacker
patent: 2003/0087172 (2003-05-01), Zhu et al.
patent: 2003/0108812 (2003-06-01), Rottstegge et al.
patent: 2003/0120099 (2003-06-01), Laine et al.
patent: 2004/0033371 (2004-02-01), Hacker
patent: 2004/0121251 (2004-06-01), Yokota et al.
patent: 2004/0137241 (2004-07-01), Lin et al.
patent: 2004/0137362 (2004-07-01), De et al.
patent: 2004/0161698 (2004-08-01), Kanagasabapathy et al.
patent: 2004/0180299 (2004-09-01), Rolland et al.
patent: 2006/0093959 (2006-05-01), Huang et al.
patent: 2006/0105181 (2006-05-01), Lin et al.
patent: 2006/0105273 (2006-05-01), Fukuda et al.
patent: 2006/0110677 (2006-05-01), Houlihan et al.
patent: 2006/0199103 (2006-09-01), Neisser et al.
patent: 2007/0254235 (2007-11-01), Allen et al.
patent: 2007/0254236 (2007-11-01), Allen et al.
patent: 2009/0011377 (2009-01-01), Allen et al.
patent: 2010/0062365 (2010-03-01), Shimada et al.
patent: 2010/0167201 (2010-07-01), Tsubaki
patent: 11-349897 (1999-12-01), None
patent: 2000-313744 (2000-11-01), None
patent: 2001-213963 (2001-08-01), None
patent: 2003-510337 (2003-03-01), None
patent: 2004-196958 (2004-07-01), None
patent: 2004-212983 (2004-07-01), None
patent: 2004-341165 (2004-12-01), None
patent: 2005-015738 (2005-01-01), None
patent: 0110871 (2001-02-01), None
patent: WO2004/012012 (2004-02-01), None
patent: 2005007747 (2005-01-01), None
Linda Geppert; Chip Making's Wet New World; IEEE Spectrum May 2004; pp. 30-33.
Office Action (Mail Date Jul. 7, 2009) for U.S. Appl. No. 12/128,171, filed May 28, 2008; Confirmation No. 9822.
Office Action (Mail Date Feb. 4, 2010) for U.S. Appl. No. 12/128,171, filed May 28, 2008; Confirmation No. 9822.
Office Action (Mail Date Jul. 20, 2010) for U.S. Appl. No. 12/128,171, filed May 28, 2008; Confirmation No. 9822.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Photoresist topcoat for a photolithographic process does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Photoresist topcoat for a photolithographic process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Photoresist topcoat for a photolithographic process will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2726801

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.