Photoresist substrate having robust adhesion

Details Photoresist substrate having robust adhesion Photoresist substrate having robust adhesion

2005-07-26

2005-07-26

Huff, Mark F. (Department: 1756)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Forming nonplanar surface

C430S324000, C264S401000

Reexamination Certificate

active

06921630

ABSTRACT:
A substrate material for LIGA applications w hose general composition is Ti/Cu/Ti/SiO2. The SiO2is preferably applied to the Ti/Cu/Ti wafer as a sputtered coating, typically about 100 nm thick. This substrate composition provides improved adhesion for epoxy-based photoresist materials, and particularly the photoresist material SU-8.

REFERENCES:
patent: 5153709 (1992-10-01), Fukuoka
patent: 6607305 (2003-08-01), Fischer et al.
“ An Investigation of SU-8 Resist adhesion in Deep X-ray Lithography of High Aspect ratio Structures”; R.L.Barber et al.; SPIE, v5276, (2004),pp 85-91.
“Fabrications of high-aspect ratio microstructures on metallic substrates using SU-8 resist”; Liu Jingquan et al.; SPIE, v4601, (2001), pp 200-204.
“ Embedded Solenoid inductor CMOS Power Amplifier”; Y-K Yoon et al.; 11 th Intl.Conf. on Solid State and A′ transducers, '01 Eurosensors XV, v2 (2001);pp. 1114-1117.

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