Photoresist removing apparatus

Details Photoresist removing apparatus Photoresist removing apparatus

1996-12-26

1998-06-02

Powell, William

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

216 92, H01L 2100

Patent

active

057593353

ABSTRACT:
An apparatus for removing a photoresist from the edge of a semiconductor wafer includes a nozzle for finely spraying a liquid for removing a photoresist. The horizontal position of the nozzle is controlled by a horizontal fixture having a screw groove formed therein. A guide rail has a channel into which the horizontal fixture is slidably inserted. A scale marked on a peripheral surface of the guide rail verifies the position of a reference mark on the horizontal fixture. A fine adjustment screw is inserted into the screw groove of the horizontal fixture to a variable depth for adjusting the horizontal position of the horizontal fixture. A shaft is connected to the guide rail, with the shaft having a top portion functioning as a piston, for adjusting the vertical position of the nozzle by fixing the guide rail to the shaft and moving the resulting combination up and down. The top portion of the shaft is movable within a cylinder. The fine horizontal and vertical adjustment of the nozzle allows adequate removal of the photoresist from the edge of the wafer, increasing the yield of the semiconductor devices.

REFERENCES:
patent: 5185056 (1993-02-01), Fuentes et al.
patent: 5268067 (1993-12-01), Dostalik et al.

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