Photoresist edge correction

Details Photoresist edge correction Photoresist edge correction

2005-03-29

2005-03-29

Duda, Kathleen (Department: 1756)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Forming nonplanar surface

C430S325000, C430S330000

Reexamination Certificate

active

06872513

ABSTRACT:
The sloped edges of patterned photoresist material are made more vertical by treating the exposed and developed photoresist pattern to an edge correction process. A layer of acid-based material is deposited on the photoresist pattern. The layer is then exposed to acid-neutralizing light to create a top-to-bottom gradient of acidity. The structure is then exposed to heat to cause the acid to diffuse into the edge of the photoresist in amounts roughly proportional to the gradient. A subsequent development process removes the acid-based layer and also reshapes the photoresist edge in proportion to the acid diffusion, leaving a more vertical edge.

REFERENCES:
patent: 20020160316 (2002-10-01), Richter et al.
patent: 20030148212 (2003-08-01), Lee et al.

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