Photoresist compound and method for structuring a...

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C430S281100, C430S284100, C430S285100, C430S286100, C430S322000, C430S330000

Reexamination Certificate

active

06841332

ABSTRACT:
A photoresist compound or composition achieves a uniform volume growth in a chemical expansion on a chemically expandable photomask during a method for structuring a layer of the photoresist compound. The photoresist composition comprises a film-forming polymer having molecular groups that can be converted into alkali-soluble groups through acid-catalyzed separation reactions, and reactive molecular groups that can react with an expansion component so as to form a chemical bond. In addition, the photoresist composition comprises a photoacid generator that releases an acid upon exposure with radiation from a suitable wavelength range, and a thermoacid generator that releases an acid when supplied with sufficient thermal energy.

REFERENCES:
patent: 5234793 (1993-08-01), Sebald et al.
patent: 5650261 (1997-07-01), Winkle
patent: 5783354 (1998-07-01), Schwalm et al.
patent: 5932391 (1999-08-01), Ushirogouchi et al.
patent: 6114086 (2000-09-01), Kobayashi et al.
patent: 20020160318 (2002-10-01), Richter et al.
patent: 20030087182 (2003-05-01), Rottstegge et al.
patent: 20030096194 (2003-05-01), Rottstegge et al.
patent: 195 33 608 (1997-03-01), None
patent: 0 395 917 (1997-06-01), None
patent: 860 740 (1998-08-01), None
patent: 1 041 445 (2000-10-01), None
patent: 1 154 321 (2001-11-01), None
Hiroshi, “Deep-UV Resists: Evolution and Status”,Solid State Technology, Jul. 1996, pp. 164-166, 168, 170, 173.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Photoresist compound and method for structuring a... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Photoresist compound and method for structuring a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Photoresist compound and method for structuring a... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3387006

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.