Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Forming nonplanar surface
Patent
1997-08-28
2000-03-14
Hamilton, Cynthia
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Forming nonplanar surface
G03F 730
Patent
active
060371072
ABSTRACT:
The invention provides photoresist compositions comprising a resin binder having acid labile blocking groups requiring an activation energy in excess of 20 Kcal/mol. for deblocking, a photoacid generator capable of generating a halogenated sulfonic acid upon photolysis and optionally, a base additive. It has been found that linewidth variation is substantially reduced when using the halogenated sulfonic acid generator in a process involving a high temperature post exposure bake.
REFERENCES:
patent: 5558971 (1996-09-01), Urano et al.
patent: 5580694 (1996-12-01), Allen et al.
patent: 5609989 (1997-03-01), Bantu et al.
patent: 5753412 (1998-05-01), Babich et al.
Wallraff et al., "Thermal and acid-catalyzed deprotection kinetics in candidate deep ultraviolet resist materials", J. Vac. Sci. Technol., 12(6), pp. 3857-3862, 1994.
Wallraff et al., "Kinetics of Chemically Amplified Resists", Tenth International Technical Conference, Oct. 31-Nov. 2, 1994, Sponsored by Society of Plastics Engineers, Inc., pp. 11-17, 1994.
Yano et al, AN 123: 354463, Abstract of Proc. SPIE-Int. Soc. Opt. Eng. (1995), 2438, pp. 551-63 Chemical Abstracts, ACS, 1998.
Cameron James F.
Sinta Roger F.
Thackeray James W.
Cairns S. Matthew
Corless Peter F.
Frickey Darryl P.
Hamilton Cynthia
Shipley Company L.L.C.
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