Photoresist composition comprising a copolymer resin

Details Photoresist composition comprising a copolymer resin Photoresist composition comprising a copolymer resin

1997-05-27

2000-01-25

Nuzzolillo, Maria

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

4302811, G03C 173

Patent

active

060176768

ABSTRACT:
A photoresist composition suitable for forming fine patterns of semiconductor devices, comprising a resin, a photosensitive acid generator and additives. The resin has a cyclic structure which is superior in thermal resistance and etch resistance as well as allowing for a light source of 200 nm or a shorter wavelength.

REFERENCES:
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Turner et al., Polym. Eng. Sci (1986), 26(16), 1096-100; see CAS Accession No. 1986:600374 and abstract.
Kim et al., Pollimo (1997), 21(1), 1-6; see CAS Accession No. 1997:205910 and abstract.
Ahn et al., Polymer (1995), 36(13), 2621-8; see CAS Accession No. 1995:664303 and abstract.
Chiang et al., J. Appl. Polym. Sci. (1993), 50(6), 1007-12; see CAS Accession No. 1994:19016 and abstract.
Turner, S. Richard et al. "Thermally stable, deep UV resist materials". Polym. Mater. Sci. Eng., 55, pp. 608-610, 1986.
CA abstract 125:11728, 1996.
CA abstract 122:303028, 1995.
CA abstract 122:118982, 1994.

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