Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Reexamination Certificate
2011-06-07
2011-06-07
Chu, John S (Department: 1722)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
C430S191000, C430S192000, C430S193000, C430S316000, C430S317000, C430S318000, C430S326000, C438S148000, C438S149000, C438S155000, C438S161000
Reexamination Certificate
active
07955784
ABSTRACT:
A photoresist composition includes about 100 parts by weight of resin mixture including novolak resin and acryl resin and about 10 parts to about 50 parts by weight of naphthoquinone diazosulfonic acid ester. A weight-average molecular weight of the novolak resin is no less than about 30,000. A weight-average molecular weight of the acryl resin is no less than about 20,000. The acryl resin makes up about 1% to about 15% of the total weight of the resin mixture. When a photoresist film formed using the photoresist composition is heated, a profile variation of the photoresist composition is relatively small. Therefore, a residual photoresist film has a uniform thickness, and a short circuit and/or an open defect in a TFT substrate may be reduced.
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Choi Jae-Young
Jeon Woo-Seok
Jung Doo-hee
Jung Si-Young
Kang Deok-Man
AZ Electronic Materials (Japan) K.K.
Cantor & Colburn LLP
Chu John S
Samsung Electronics Co,. Ltd.
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