Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
2006-01-17
2008-10-28
Walke, Amanda C. (Department: 1795)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
C430S913000, C430S917000
Reexamination Certificate
active
07442489
ABSTRACT:
In a photoresist composition for a semiconductor manufacturing process and a method of forming a photoresist pattern using the photoresist composition, the photoresist composition includes an organic dispersing agent for dispersing acid (H+). The photoresist film may have enough spaces among photosensitive polymers so that acid may be dispersed sufficiently in an exposure process. Thus, a photoresist pattern may be easily formed in a defocus region. Defects in a semiconductor device may be reduced and a productivity of the semiconductor manufacturing process may be enhanced.
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English language abstract of Japanese Publication No. 2002-006495.
English language abstract of Japanese Publication No. 2002-023373.
Kim Boo-Deuk
Kim Jae-Ho
Kim Kyoung-Mi
Kim Young-Ho
Ryu Jin-A
Marger & Johnson & McCollom, P.C.
Samsung Electronics Co,. Ltd.
Walke Amanda C.
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