Patterning method by laser scribing

Details Patterning method by laser scribing Patterning method by laser scribing

1988-05-27

1989-10-31

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156651, 156645, 156656, 156667, 156668, 21912169, 21912185, 427 531, B44C 122, C03C 1500, C03C 2506, C23F 102

Patent

active

048774812

ABSTRACT:
A laser scribing method is described. A laser beam is deprived of its tail which appears along a groove which is engraved by scribing. The scribing can be performed without forming protrusion along the edge of grooves engraved by the scribing. The depriving of the tail is accomplished by coating the film with a buffer film which is removed after the scribing.

REFERENCES:
patent: 3665483 (1972-05-01), Becker et al.
patent: 3787873 (1974-01-01), Sato et al.
patent: 3867217 (1975-02-01), Maggs et al.
patent: 3956052 (1976-05-01), Koste et al.
patent: 4037075 (1977-07-01), Pugsley et al.
patent: 4046986 (1977-09-01), Barker
patent: 4568409 (1986-02-01), Caplan
patent: 4713518 (1987-12-01), Yamazaki
Bakhru et al., "Inhibiting Adhesion of Silicon Particles to the Surface of a Silicon Semiconductor Wafer During Laser Dicing", IBM Technical Disclosure Bulletin, vol. 15, No. 4, Sep. 1972, p. 1079.

Affiliated with

Also associated with

Rating

Patterning method by laser scribing does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Patterning method by laser scribing, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Patterning method by laser scribing will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-623845