Pattern transfer in device fabrication

Details Pattern transfer in device fabrication Pattern transfer in device fabrication

2006-08-15

2006-08-15

Duda, Kathleen (Department: 1756)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Forming nonplanar surface

C430S330000

Reexamination Certificate

active

07090967

ABSTRACT:
A method of transferring a pattern onto a substrate, in the fabrication of ICs, is disclosed. The substrate is coated with a photoresist layer, wherein the photoresist layer is selectively exposed and developed, producing sidewalls that exhibit roughness. The roughness is smoothened out by coating the photoresist layer with a coating layer.

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patent: 6225031 (2001-05-01), Appelt et al.
patent: 6753117 (2004-06-01), Lu
patent: 2002/0168594 (2002-11-01), Lin et al.
patent: 2003/0027080 (2003-02-01), Lu
patent: 2004/0043332 (2004-03-01), Yamamoto et al.

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