Pattern reversal employing thick residual layers

Details Pattern reversal employing thick residual layers Pattern reversal employing thick residual layers

2004-09-21

2009-06-16

Chea, Thorl (Department: 1795)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Forming nonplanar surface

C216S044000, C216S052000, C216S054000

Reexamination Certificate

active

07547504

ABSTRACT:
The present invention features a method of patterning a substrate that includes forming, on the substrate, a first layer having a first pattern and selectively shifting in tone, as well as along a first direction, a subsequent pattern formed into the same layer that corresponds to the first pattern. To that end, one method of the present invention includes generating into the first layer, a second pattern having a shape inverse to the first pattern. A third pattern is then transferred into the first layer that has a shape inverse to the second pattern.

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