Pattern forming method and apparatus for fabricating...

Details Pattern forming method and apparatus for fabricating... Pattern forming method and apparatus for fabricating...

2005-02-15

2005-02-15

Huff, Mark F. (Department: 1756)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Forming nonplanar surface

C430S313000, C430S327000, C430S330000

Reexamination Certificate

active

06855485

ABSTRACT:
A resist film is formed out of a resist material on a substrate, and then pre-baked. Next, the pre-baked resist film is exposed to extreme ultraviolet radiation through a photomask. Then, the exposed resist film is developed, thereby defining a resist pattern on the substrate. The pre-baking and exposing steps are carried out in a vacuum without subjecting the resist film to the air.

REFERENCES:
patent: 4764247 (1988-08-01), Leveriza et al.
patent: 6074804 (2000-06-01), Endo et al.
patent: 6245491 (2001-06-01), Shi
patent: 6368776 (2002-04-01), Harada et al.
patent: 5-206020 (1993-08-01), None
patent: 2000-131854 (2000-05-01), None
www.lamrc.com, TCP® 9400DFM-Silicon Etch, Jul. 24, 2003, Lam Research®, 3 pgs.

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