Pattern forming method

Details Pattern forming method Pattern forming method

1987-12-24

1990-03-20

Dees, Jose G.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Forming nonplanar surface

430190, 430193, 430945, G03C 516

Patent

active

049101234

ABSTRACT:
Disclosed is a pattern forming method using pattern forming material which is reactive to a light of 249 nm or so such as DUV light or excimer laser light and applicable to manufacture of semiconductors. The material used in this method includes resin which includes a bonding unit of ##STR1## and has low absorption near 249 nm after light exposure, and is soluble in a solvent which dissolves the resin. By this method, a fine pattern of high contrast can be obtained.

REFERENCES:
patent: 4522911 (1985-06-01), Clecak et al.
patent: 4529682 (1985-07-01), Toukhy
patent: 4626491 (1986-12-01), Gray

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