Pattern forming method

Details Pattern forming method Pattern forming method

1993-03-24

1994-12-13

Baxter, Janet C.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Electron beam imaging

430326, 430330, 430921, 430270, 430271, 430273, G03C 500

Patent

active

053729145

ABSTRACT:
On a substrate a protective layer is formed which can suppress the diffusion of a contaminant from the substrate. On the protective layer, thus formed, a resin layer is formed. The resin layer comprises a photosensitive composition containing a compound which has a substituent group capable of being decomposed or cross-linked in the presence of an acid, and a compound which can generate an acid when exposed to light. The resin layer is pattern-exposed to light and then baked at a predetermined temperature. The resin layer is developed, whereby the exposed portions of the resin layer are removed or left, thus forming a pattern comprising lines and spaces each having a predetermined width. Each of the lines of the pattern has a cross-section having neither sloped profile nor undercut profile, and the pattern therefore has an improved resolution.

REFERENCES:
patent: 4454222 (1984-06-01), Tada et al.
patent: 4745045 (1988-05-01), Fredericks et al.
patent: 4822718 (1989-04-01), Latham et al.
patent: 4910122 (1990-03-01), Arnold et al.
patent: 5198326 (1993-03-01), Hashimoto et al.

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