Pattern data verification method, pattern data creation...

Details Pattern data verification method, pattern data creation... Pattern data verification method, pattern data creation...

2005-11-28

2009-10-06

Do, Thuan (Department: 2825)

Computer-aided design and analysis of circuits and semiconductor

Nanotechnology related integrated circuit design

C716S030000, C716S030000, C430S005000, C430S030000

Reexamination Certificate

active

07600213

ABSTRACT:
A pattern data verification method includes preparing exposure data related to a circuit pattern to be formed on a substrate, calculating a characteristic of an image of an exposure pattern on a resist film to be applied on the substrate, the exposure pattern corresponding to the exposure data, calculating a film thickness of the resist film after being developed based on the characteristic of the image of the exposure pattern, and determining whether the exposure data is acceptable or rejectable based on the film thickness of the resist film after being developed.

REFERENCES:
patent: 5889686 (1999-03-01), Mimotogi et al.
patent: 6449386 (2002-09-01), Nakao
patent: 6470489 (2002-10-01), Chang et al.
patent: 6633203 (2003-10-01), Joe
patent: 09055352 (1997-02-01), None
patent: 9-319067 (1997-12-01), None
patent: 2003-107664 (2003-04-01), None
Belledent, et al., “Critical failure ORC—Application to the 90-nm and 65-nm nodes”, Proceedings of SPIE, vol. 5377, pp. 1184-1197, (2004).
D. Newmark et al., “Large Area Optical Proximity Correction using Pattern Based Corrections,” SPIE (1994), 2322::374-386.

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