Pattern component analysis and manipulation

Details Pattern component analysis and manipulation Pattern component analysis and manipulation

2006-11-14

2006-11-14

Whitmore, Stacy A. (Department: 2825)

Computer-aided design and analysis of circuits and semiconductor

Nanotechnology related integrated circuit design

C716S030000

Reexamination Certificate

active

07137098

ABSTRACT:
A method for determining component patterns of a raw substrate map. A subset of substrate patterns is selected from a set of substrate patterns, and combined into a composite substrate map. The substrate patterns are weighted. The composite substrate map is compared to the raw substrate map, and a degree of correlation between the composite substrate map and the raw substrate map is determined. The steps are iteratively repeated until the degree of correlation is at least a desired degree, and the weighted subset of substrate patterns is output as the component patterns of the raw substrate map.

REFERENCES:
patent: 6070004 (2000-05-01), Prein
patent: 6424929 (2002-07-01), Dawes
patent: 6986112 (2006-01-01), Whitefield et al.
patent: 7013192 (2006-03-01), Whitefield et al.
patent: 7039556 (2006-05-01), Whitefield et al.
patent: 2003/0144810 (2003-07-01), Tabor
patent: 2003/0229410 (2003-12-01), Smith et al.
patent: 2004/0039548 (2004-02-01), Selby et al.
patent: 2004/0138846 (2004-07-01), Buxton et al.
patent: 2004/0162692 (2004-08-01), Ye et al.
patent: 2004/0267477 (2004-12-01), Scott et al.
patent: 2005/0060336 (2005-03-01), Abercrombie et al.
patent: 2005/0132308 (2005-06-01), Whitefield et al.
patent: 2005/0227587 (2005-10-01), Yang
patent: 2005/0278678 (2005-12-01), Whitefield et al.
patent: 2006/0031788 (2006-02-01), Bauer
patent: 2006/0059452 (2006-03-01), Whitefield et al.
patent: 2006/0085155 (2006-04-01), Miguelanez et al.

Affiliated with

Also associated with

Rating

Pattern component analysis and manipulation does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Pattern component analysis and manipulation, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Pattern component analysis and manipulation will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3687520