Semiconductor device manufacturing: process – Chemical etching – Combined with coating step
Patent
1997-05-05
1998-12-29
Utech, Benjamin
Semiconductor device manufacturing: process
Chemical etching
Combined with coating step
438696, 438705, 438720, 438734, H01L 21302
Patent
active
058541349
ABSTRACT:
The invention provides a method of fabricating corrosion free metal lines. The method involves forming a thin polymeric passivation layer 30 over the metal layer 20 immediately after the metal deposition and before any photolithographic or etching processes. The polymeric passivation layer 30 is formed using a F-containing gas plasma treatment. The passivation layer prevents corrosion of the metal layer before a metal etch. The passivation layer is preferably composed of a polymeric of C, O, and F and has a thickness in a range of between about 40 and 80 .ANG.. The passivation layer is formed using a F-containing plasma treatment at a power of between 225 and 275 W, a pressure between about 80 and 120 mtorr, a CHF.sub.3 flow between about 40 and 60 sccm and for a duration between about 10 to 30 seconds. Following this, the metal layer is patterned using photo and etch steps.
REFERENCES:
patent: 5202291 (1993-04-01), Charvat et al.
patent: 5378653 (1995-01-01), Yanagida
patent: 5397432 (1995-03-01), Konno et al.
patent: 5399236 (1995-03-01), Ha et al.
patent: 5451293 (1995-09-01), Tabara
"In Line Plasma Etching of Aluminum"; Proc-Electrochemical Soc.; 1982; 82-6-Proc. Sym Plasma Process, 3rd, 1981; abstract only; Donohoe.
Horng Shean-Ren
Lan Chao-Yi
Shen Yun-Hung
Tsai Hung-Jen
Ackerman Stephen B.
Goudreau George
Saile George O.
Stoffel William J.
Taiwan Semiconductor Manufacturing Company , Ltd.
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