Metal treatment – Process of modifying or maintaining internal physical... – Producing or treating layered – bonded – welded – or...
Patent
1995-06-07
1998-06-16
Zimmerman, John J.
Metal treatment
Process of modifying or maintaining internal physical...
Producing or treating layered, bonded, welded, or...
427 96, 148277, 148285, C22F 3806, C22F 3816
Patent
active
057663793
ABSTRACT:
A copper conductor is formed which is included as a component in microelectronic devices. The conductor is formed by forming a metal layer on the surface of a microelectronic substrate, forming a copper layer on the metal layer, and annealing the metal and copper layers. The annealing step diffuses at least some of the metal layer through the copper layer to the surface thereof where the diffused metal forms a protective metal oxide at the surface of the copper layer. As a result, the metal oxide layer passivates the copper layer.
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Ding Peijun
Lanford William A.
Wang Wei
The Research Foundation of State University of New York
Zimmerman John J.
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