Partial vertical memory cell and method of fabricating the same

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S386000

Reexamination Certificate

active

07033886

ABSTRACT:
A partial vertical memory cell and fabrication method thereof. A semiconductor substrate is provided, in which two deep trenches having deep trench capacitors respectively are formed, and the deep trench capacitors are lower than a top surface of the semiconductor substrate. A portion of the semiconductor outside the deep trenches is removed to form a pillar between. The pillar is ion implanted to form an ion-doped area in the pillar corner acting as a S/D area. A gate dielectric layer and a conducting layer are conformally formed on the pillar sequentially. An isolation is formed in the semiconductor substrate beside the conducting layer. The conducting layer is defined to form a first gate and a second gate.

REFERENCES:
patent: 6514816 (2003-02-01), Lee

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