Pad conditioner

Details Pad conditioner Pad conditioner

2007-04-11

2010-10-19

Rachuba, Maurina (Department: 3727)

Abrading

Accessory

Dressing

C451S444000

Reexamination Certificate

active

07815495

ABSTRACT:
A pad conditioner is provided for conditioning a polishing pad in chemical mechanical planarization (CMP). The pad conditioner comprises a plastic abrasive portion having a first hardness and optionally a brush portion having a second hardness less than the first hardness. The plastic abrasive portion comprises a base plate and a plurality of plastic nodules formed on a surface of the base plate, each of the plastic nodules having a planar top surface, wherein the planar top surface is positioned to substantially contact a polishing pad. The brush portion may be positioned adjacent to the plastic abrasive portion, the brush portion having a plurality of brush elements positioned to substantially contact the pad.

REFERENCES:
patent: 3743489 (1973-07-01), Wentorf, Jr. et al.
patent: 3767371 (1973-10-01), Wentorf, Jr. et al.
patent: 4062660 (1977-12-01), Nicholas et al.
patent: 4225322 (1980-09-01), Knemeyer
patent: 4661180 (1987-04-01), Frushour
patent: 4845902 (1989-07-01), Bolliand
patent: 5643052 (1997-07-01), Delattre et al.
patent: 6159087 (2000-12-01), Birang et al.
patent: 6200199 (2001-03-01), Gurusamy et al.
patent: 6224470 (2001-05-01), Hoey et al.
patent: 6300223 (2001-10-01), Chang et al.
patent: 6322427 (2001-11-01), Li et al.
patent: 6325709 (2001-12-01), Nanda et al.
patent: 6341997 (2002-01-01), Lin
patent: 6361423 (2002-03-01), Gurusamy et al.
patent: 6371836 (2002-04-01), Brown et al.
patent: 6386963 (2002-05-01), Kenji et al.
patent: 6476488 (2002-11-01), Jeng et al.
patent: 6524357 (2003-02-01), Baldoni et al.
patent: 6540597 (2003-04-01), Ohmori et al.
patent: 6551176 (2003-04-01), Garretson
patent: 6632127 (2003-10-01), Zimmer et al.
patent: 6945857 (2005-09-01), Doan et al.
patent: 7033253 (2006-04-01), Dunn
patent: 7150677 (2006-12-01), Yamashita et al.
patent: 2002/0065029 (2002-05-01), Huang et al.
patent: 2002/0127962 (2002-09-01), Cho et al.
patent: 2006/0035568 (2006-02-01), Dunn
patent: 2009/0075567 (2009-03-01), Wang et al.

Affiliated with

Also associated with

Rating

Pad conditioner does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Pad conditioner, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Pad conditioner will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4216816