Packing structure for container for semiconductor wafer and pack

Details Packing structure for container for semiconductor wafer and pack Packing structure for container for semiconductor wafer and pack

1997-09-30

1998-09-15

Moon, Daniel

Package making

Methods

Filling preformed receptacle and closing

53445, 53449, 53474, B65B 2300

Patent

active

058062866

ABSTRACT:
A packing structure for a container for containing semiconductor wafers is disclosed. The packing structure comprises a polypropylene box, and upper and lower pressing members for sandwiching the container for containing semiconductor wafers, wherein both the upper and lower pressing members comprise an olefinic resin.

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