4. Package making
  5. Methods
  6. Filling preformed receptacle and closing

Kenji Oinuma

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Packing structure for container for semiconductor wafer and pack

Special receptacle or package – Holder for a removable electrical component – For a semiconductor wafer
Patent

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Packing structure for container for semiconductor wafer and pack

Package making – Methods – Filling preformed receptacle and closing
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

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Profile ID: LFUS-PAI-P-170688

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