Package making – Methods – Forming or partial forming a receptacle and subsequent filling
Patent
1997-06-13
1998-09-15
Moon, Daniel
Package making
Methods
Forming or partial forming a receptacle and subsequent filling
53559, 53122, 53127, 53440, B65B 6308
Patent
active
058062858
DESCRIPTION:
BRIEF SUMMARY
The present invention relates to a process for packaging, in the fluid state, sticky substances which are sticky or soft at the room or handling temperature, and in particular to adhesives and sealants which are solid or semisolid and sticky at the room or handling temperature and which are applied, in the melted state, at temperatures higher than the room temperature, hereinbelow referred to in short as HMPSA (Hot Melt Pressure Sensitive Adhesives) or simply adhesives. The invention also relates to a preferred packaging plant in which said process is implemented. The process and the plant according to the present invention are obviously not limited to the specific products mentioned above, but are also applicable, with the identical advantages, for the packaging in the fluid state of other types of substances which are soft or sticky, or are simply contaminating, at the room or handling temperature, such as for example food mixtures or products, detergent products and cosmetics and the like. In the description which follows, reference will be made exclusively, for the sake of simplicity, to adhesive products alone.
Adhesive products are marketed in portions of varying size, which are used by introducing them directly into special melting devices in which the adhesive liquefies and can be easily applied to the desired article, on which it solidifies as soon as its temperature falls below the melting temperature. Obviously the abovementioned portions of adhesive are very sticky, both in the liquid state and in the solid or semisolid state, and must therefore be suitably packaged so as to allow easy handling thereof without causing problems of stickiness or soiling for the operators, and contamination of the product with the packaging material which remains stuck to it.
According to the most well-established prior art, packaging of the portions of adhesive is performed by casting the said portions, in the melted state, inside suitable containers (cartons, boxes, drums, etc.) made of silicone-lined plastic, cardboard or paper which, after a suitable cooling period, are stacked and packed ready for despatch.
This prior art, however, has some major drawbacks. Firstly, the silicone-lined containers represent an additional cost which is not insignificant for the manufacturer; secondly, the duration of the packaging process is excessively long, in particular owing to the long cooling times which are necessary before the adhesive is solid enough to be transported; finally, the user has the drawbacks of the time which is lost in order to unpack each portion of adhesive, a large quantity of empty packages to be disposed of and finally the danger of contamination of the product in the event of difficulty in separating the packaging material from it.
The abovementioned process is therefore being abandoned by many manufacturers in this sector who, in response to users' requirements, have developed packaging systems which no longer require the elimination of the package itself prior to use of the adhesive. This new type of package consists of a thermoplastic material having a chemical composition compatible with that of the packaged adhesive substance and which therefore does not contaminate, or contaminates only partially and to an acceptable degree, the adhesive substance itself once it is melted inside the melting device by the user and which, moreover, is not sticky at the handling temperature, in particular at the room temperature, making it possible to use external packaging which is cheaper or, even better, of the returnable type.
This intuition has provided the stimulus for the development of a very large number of processes which greatly differ not only on account of the chemical composition of the packaging layer but also on account of the procedures for applying said packaging layer to the portion of adhesive, both with regard to the original physical form of the protective coating and with respect to the method and the moment of application during the process for packaging of the portions of adhesive.
These k
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Moon Daniel
Sav. Ind. S.r.l.
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