Semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S307000

Reexamination Certificate

active

06906374

ABSTRACT:
A semiconductor device without any peel off from the insulation film and without any fracture that becomes the cause of a short circuit is obtained even if a metal such as Ru is employed for the storage node. On the semiconductor substrate are provided an underlying interlayer insulation film located over both a capacitor region and a peripheral region, an interlayer insulation film located above the underlying interlayer insulation film, and a tubular metal film having a bottom end portion in contact with the underlying interlayer insulation film, and piercing the interlayer insulation film with the opening side located at the upper side in the capacitor region and the peripheral region. The opening side of the tubular metal film is formed only of a portion extending along the sidewall of a throughhole in the interlayer insulation film.

REFERENCES:
patent: 5851870 (1998-12-01), Alugbin et al.
patent: 6130126 (2000-10-01), Iwakiri
patent: 6175130 (2001-01-01), Hosotani et al.
patent: 6362042 (2002-03-01), Hosotani et al.
patent: 6368910 (2002-04-01), Sheu et al.
patent: 6534375 (2003-03-01), Iijima et al.
patent: 6605530 (2003-08-01), Nakamura et al.
patent: 2004/0075132 (2004-04-01), Lee
patent: 2001-339050 (2001-12-01), None
patent: 1998-070626 (1998-10-01), None

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