Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2006-02-28
2009-08-18
Clark, Jasmine J (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S678000, C257S692000, C257S696000, C257S726000, C257S727000
Reexamination Certificate
active
07576429
ABSTRACT:
The invention claimed is a packaged semiconductor device with dual exposed surfaces and a method of manufacturing the device. A thermal clip and one or multiple source pads are exposed on opposite ends of the device through a nonconductive molding material used to package the device. The thermal clip and source pad can be either top or bottom-exposed. The gate, source and drain leads are exposed through the molding material, and all leads are coplanar with the bottom-exposed surface. The device can have multiple semiconductor dies or various sized dies while still having a single, constant footprint. The method of manufacturing requires attaching the semiconductor die to a thermal clip, and then attaching the die with the attached thermal clip to a lead frame. The resulting device is then molded, marked, trimmed and singulated, in this order, creating a packaged semiconductor device with dual exposed surfaces.
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International Searching Authority; International Search Report and Written Opinion; Mailed Apr. 1, 2008 in PCT/US06/62695 (12 pages).
Madrid Ruben P.
Manatad Romel N.
Clark Jasmine J
Fairchild Semiconductor Corporation
FitzGerald Esq. Thomas R.
Hiscock & Barclay LLP
Lott, Esq. Robert D.
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