Single or multi-layer printed circuit board with improved...

Details Single or multi-layer printed circuit board with improved... Single or multi-layer printed circuit board with improved...

2004-11-11

2009-02-03

Norris, Jeremy C (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S262000, C361S760000

Reexamination Certificate

active

07485812

ABSTRACT:
A circuit board or each circuit board of a multi-layer circuit board includes an electrically conductive sheet coated with an insulating top layer covering one surface of the conductive sheet, an insulating bottom layer covering another surface of the conductive sheet and an insulating edge layer covering an edge of the conductive sheet. An insulating interlayer can be sandwiched between a pair of adjacent circuit boards of a multi-layer circuit board assembly. A landless through-hole or via can extend through one or more of the circuit boards for connecting electrical conductors on opposing surfaces thereof.

REFERENCES:
patent: 4303715 (1981-12-01), Chang
patent: 4712161 (1987-12-01), Pryor et al.
patent: 5282312 (1994-02-01), DiStefano et al.
patent: 6844504 (2005-01-01), Wang et al.
patent: 7002081 (2006-02-01), Wang et al.
patent: 2004/0001325 (2004-01-01), Wang et al.
patent: 0 981 268 (2000-02-01), None
patent: 1 069 811 (2001-01-01), None
patent: EP-0264105 (1987-04-01), None

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