Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2006-08-22
2006-08-22
Whitehead, Jr., Carl (Department: 2829)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
Reexamination Certificate
active
07095111
ABSTRACT:
A package for a die includes a porous wick layer disposed between the die and a substrate. A sealed chamber between the die and substrate includes a phase-change fluid to transfer heat from a substrate side of the die to a heat spreader. Interconnects coupling bonding pads of the die to the substrate may pass through the chamber and through vias in the wick layer. In embodiments, the wick layer may have a coefficient of thermal expansion (CTE) matching a CTE of the die of the heat spreader. Heat generated by the die may evaporate the fluid in a die region and the evaporated fluid may condense in a heat spreader region. The wick layer returns the condensed fluid from the heat spreader region to the die region to complete the cycle. The fluid may be non-corrosive with respect to the interconnects and may be an electrical insulator. In embodiments, the wick layer in the heat spreader region may be disposed on the heat spreader in a pattern to efficiently draw the condensed fluid to the die region. In other embodiments, the wick layer may comprise materials of different pore size and porosity to efficiently draw the condensed fluid to the die region.
REFERENCES:
patent: 5780928 (1998-07-01), Rostoker et al.
Bakir, M S., et al., “Sea of leads ultra high-density compliant wafer-level packaging technology”,52nd Electronic Components and Technology Conference 2002, (May 31, 2002), 1087-94.
Ma, Lunyu, et al., “J-Springs—innovative compliant interconnects for next-generation packaging”,52nd Electronic Components and Technology Conference 2002, (May 31, 2002), 1359-65.
Rosenfeld, John H., et al., “Internally extended surface heat pipe evaporators for microelectronics cooling”,Fundamentals of phase change—boiling and condensation : presented at the 6th AIAA/ASME Thermophysics and Heat Transfer Conference, Colorado Springs, Colorado, Jun. 20-23, 1994 /, (1994), 93-100.
Yusuf, I, et al., “Integrated heat sink—heat pipe thermal cooling device”,ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, (May 23-26, 2000), 27-30.
Emery Richard D.
Hu Chuan
Harrison Monica D.
Intel Corporation
Jr. Carl Whitehead
Schwegman Lundberg Woessner & Kluth P.A.
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