P-channel power MIS field effect transistor and switching...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S411000, C257S627000, C257SE29004, C257SE29106

Reexamination Certificate

active

07928518

ABSTRACT:
In a P-channel power MIS field effect transistor formed on a silicon surface having substantially a (110) plane, a gate insulation film is used which provides a gate-to-source breakdown voltage of 10 V or more, and planarizes the silicon surface, or contains Kr, Ar, or Xe.

REFERENCES:
patent: 6357385 (2002-03-01), Ohmi et al.
patent: 6483156 (2002-11-01), Adkisson et al.
patent: 6551948 (2003-04-01), Ohmi et al.
patent: 6720632 (2004-04-01), Noda
patent: 6903393 (2005-06-01), Ohmi et al.
patent: 2002/0072158 (2002-06-01), Tanabe et al.
patent: 2004/0032003 (2004-02-01), Ohmi et al.
patent: 2006/0138538 (2006-06-01), Ohmi et al.
patent: 04372166 (1992-12-01), None
patent: 07231088 (1995-08-01), None
patent: 09010713 (1997-01-01), None
patent: 11057636 (1999-03-01), None
patent: 11307497 (1999-11-01), None
patent: 2000150792 (2000-05-01), None
patent: 2003115587 (2003-04-01), None
patent: 2004200672 (2004-07-01), None
patent: WO-9833362 (1998-07-01), None
patent: WO-03032399 (2003-04-01), None
“U.S. Appl. No. 11/285,772, Response filed Oct. 3, 2008 to Non-Final Office Action mailed Apr. 3, 2008”, 14 pgs.
“U.S. Appl. No. 11/285,772, Response filed Jul. 24, 2007 to Non-Final Office Action mailed Apr. 6, 2007”, 16 pgs.
“U.S. Appl. No. 11/285,772 Non-Final Office Action mailed Apr. 3, 2008”, 9 lpgs.
“U.S. Appl. No. 11/285,772 Response filed Jun. 11, 2009 to Final Office Action mailed Jan. 16, 2009”, 15 pgs.
“U.S. Appl. No. 11/285,772, Notice of Allowance mailed Jun. 30, 2009”, 7 pgs.
“U.S. Appl. No. 11/285,772, Response filed Jun. 11, 2009 to Final Office Action mailed Jan. 16, 2009”, 15 pgs.
“U.S. Appl. No. 11/285,772, Final Office Action mailed Oct. 10, 2007”, 9 pgs.
“U.S. Appl. No. 11/285,772, Non Final Office Action mailed Apr. 6, 2007”, 7 pgs.
“U.S. Appl. No. 11/285,772, Response filed Mar. 19, 2007 to Restriction Requirement mailed Feb. 20, 2007”, 12 pgs.
“U.S. Appl. No. 11/285,772, Restriction Requirement mailed Feb. 20, 2007”, 5 pgs.
“U.S. Appl. No. 11/285,772, Response filed Feb. 22, 2008 to Final Ofifce Action mailed Oct. 10, 2007”, 17 pgs.
“European Patent Application No. 04745284, Communication and European Search Report mailed Jun. 12, 2008”, 7 pgs.
“Japanese Application Serial No. JP2000-150792, Office Action dated Sep. 8, 2009, with partial English translation,”, (Sep. 8, 2009), 8 pgs.
“U.S. Appl. No. 11/285,772 Final Office Action mailed Jan. 16, 2009”, 11 pgs.
Hirayama, M., et al., “Low temperature growth of high integrity silicon films by oxygen radical generated in high density krypton plasma”,Electron devices meeting, 1999, 249-252.
Miyashita, M., et al., “Dependence of Surface Microroughness of CZ, FZ and EPI Wafers on Wet Chemical Processing”,J. Electrochem. Soc., vol. 139, No. 8, (Aug. 1992), 2133-2142.
Nagamine, Makoto, et al., “Radical Oxygen (O*) Process for Highly-Reliable SiO2 with Higher Film-Density and Smoother SiO2/Si Interface”,International Electron Devices Meeting Technical Digest, (1998), 593-596.
Ohtsubo, K., et al., “Low temperature growth(400 oc) of high integrity thin silicon-oxynitride films by microwave-excited high-density Kr/02/NH3 plasma”,Proceedings, 22nd Convention of Electrical and Electronic Engineers in Israel, (Piscataway, NJ), (2002), 166-169.
Saito, Y., et al., “A study of direct oxidation and oxynitridation of silicon surface by using radical generated in microwave-excited high-density plasma”,Record of Electrical and Communication Engineering Conservazione, 71(1), (2002), 105-108.
Sato, Karzuo, et al., “Roughening of single-crystal silicon surface etched by KOH water solution”,Sensors and Actuators, vol. 73, (1999), 122-130.
Sato, Tai, et al., “Mobility Anisotrophy of Electrons in Inversion Layers on Oxidized Silicon Surfaces”,Physical Review B, vol. 4, No. 6, (Sep. 15, 1971), 1950-1960.
Throngnumchai, K ., “Ultralow On-Resistance P-Channel Lateral DMOS Fabricated on (110)-Oriented Si Substrate”,IEEE Transactions on Electron Devices, vol. 40, No. 11, (Nov. 1993), 2132-2133.
Tsukuda, T., et al., “Low temperature growth of Si oxide with good electrical qualities using Helicon-wave-excited O2-AR Plasma and forming gas annealing”,Japanese journal of applied Physics, vol. 39(1), (2000), 8-13.

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