Oscillating chemical mechanical planarization apparatus

Details Oscillating chemical mechanical planarization apparatus Oscillating chemical mechanical planarization apparatus

2005-06-07

2005-06-07

Rachuba, M. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S168000, C451S173000

Reexamination Certificate

active

06902466

ABSTRACT:
A chemical mechanical polishing (CMP) apparatus is provided. The CMP apparatus includes a first roller situated at a first point and a second roller situated at a second point. The first point is separate from the second point. Also included in the apparatus is a polishing pad strip having a first end secured to the first roller and a second end secured to the second roller. The first roller and the second roller are configured to reciprocate so that the polishing pad strip oscillates at least partially between the first point and the second point.

REFERENCES:
patent: 6428394 (2002-08-01), Mooring et al.
patent: 6520833 (2003-02-01), Saldana et al.

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