Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
2006-03-21
2006-03-21
Walke, Amanda (Department: 1752)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
C427S376100, C427S383100, C106S001130, C106S001140, C106S287110
Reexamination Certificate
active
07014979
ABSTRACT:
An organometallic precursor mixture for forming a metal alloy pattern and a method of forming the metal alloy pattern using the same, wherein the metal alloy pattern having improved adhesive force to a substrate, heat resistance, and resistance to atmospheric corrosion can be readily formed using the organometallic precursor mixture by and exposing step without using a separate photosensitive resin.
REFERENCES:
patent: 5064685 (1991-11-01), Kestenbaum et al.
patent: 5387492 (1995-02-01), McCormick et al.
patent: 5514728 (1996-05-01), Lamanna et al.
patent: 5534312 (1996-07-01), Hill et al.
patent: 5856022 (1999-01-01), McCormick et al.
patent: 6348239 (2002-02-01), Hill et al.
patent: 62-263973 (1987-11-01), None
patent: 2001-221908 (2001-08-01), None
patent: 2001-226765 (2001-08-01), None
patent: 2003215792 (2003-07-01), None
patent: WO 02/40637 (2002-05-01), None
Byun Young Hun
Hwang Soon Taik
Son Hae Jung
Yun Byong Ki
Harness Dickey & Pierce PLC
Samsung Electronics Co,. Ltd.
Walke Amanda
LandOfFree
Organometallic precursor mixture for forming metal alloy... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Organometallic precursor mixture for forming metal alloy..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Organometallic precursor mixture for forming metal alloy... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3614303