Optical integrated circuits (ICs)

Etching a substrate: processes – Forming or treating optical article

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C216S025000, C216S039000

Reexamination Certificate

active

07087179

ABSTRACT:
In one aspect, the invention provides methods and apparatus for forming optical devices on large area substrates. The large area substrates are preferably made of quartz, silica or fused silica. The large area substrates enable larger optical devices to be formed on a single die. In another aspect, the invention provides methods and apparatus for forming integrated optical devices on large area substrates, such as quartz, silica or fused silica substrates. In another aspect, the invention provides methods and apparatus for forming optical devices using damascene techniques on large area substrates or silicon substrates. In another aspect, methods for forming optical devices by bonding an upper cladding layer on a lower cladding and a core is provided.

REFERENCES:
patent: 4425146 (1984-01-01), Izawa et al.
patent: 4578691 (1986-03-01), Murakami et al.
patent: 4619680 (1986-10-01), Nourshargh et al.
patent: 4856859 (1989-08-01), Imoto
patent: 4972799 (1990-11-01), Misumi et al.
patent: 5125946 (1992-06-01), Bhagavatula
patent: 5165004 (1992-11-01), Okamoto et al.
patent: 5253319 (1993-10-01), Bhagavatula
patent: 5378256 (1995-01-01), Green et al.
patent: 5396351 (1995-03-01), Gessel
patent: 5408569 (1995-04-01), Nishimoto
patent: 5567476 (1996-10-01), Law et al.
patent: 5689614 (1997-11-01), Gronet et al.
patent: 5858051 (1999-01-01), Komiyama et al.
patent: 5881199 (1999-03-01), Li
patent: 5885881 (1999-03-01), Ojha
patent: 5904491 (1999-05-01), Ojha et al.
patent: 5930439 (1999-07-01), Ojha et al.
patent: 5949934 (1999-09-01), Shima et al.
patent: 5961924 (1999-10-01), Reichert et al.
patent: 5999293 (1999-12-01), Manning
patent: 6024044 (2000-02-01), Law et al.
patent: 6151430 (2000-11-01), Traver, Jr. et al.
patent: 6222971 (2001-04-01), Veligdan et al.
patent: 6282358 (2001-08-01), Hornbeck et al.
patent: 6306563 (2001-10-01), Xu et al.
patent: 6377716 (2002-04-01), Veldhuis et al.
patent: 6500603 (2002-12-01), Shioda
patent: 6553164 (2003-04-01), Ono et al.
patent: 6724968 (2004-04-01), Lackritz et al.
patent: 0 575 157 (1993-12-01), None
patent: 0 803 589 (1997-10-01), None
patent: 1 014 121 (2000-06-01), None
patent: 06263452 (1994-09-01), None
patent: 11052159 (1999-02-01), None
patent: WO-A-0125829 (2001-04-01), None
PCT Written Opinion for PCT/US01/47493, dated Mar. 12, 2004 (AMAT/5621.PC).
A. Kilian, et al. “Birefringence Free Planar Optical Waveguide Made by Flame Hydrolysis Deposition (FHD) Through Tailoring of the Overcladding”,J. Lightwave Tech. vol. 18. No. 2 (Feb. 2000).
Kashimura, et al., “Loss Reduction of GeO2-Doped Silica Waveguide with High Refractive Index Difference By High-Temperature Annealing”, 39Jpn. J. Appl. Phys. vol. 39 No. 6A, Pt. 2 (Apr. 2000).
Tan, et al., “Fabrication of Gratings and Design of Diffractive Optical Elements Embossed on Sol-Gel Films”SPIE Conf. on Design, Fabrication&Characterization of Photonic Devices(Nov. 1999).
Sun, et al., “Building Passive Components with Silica Waveguides”,SPIE Conf. on Terahertz&Gigahertz Photonics, pp. 313-319 (Jul. 1999).
Jung, et al., “Inductively Coupled Plasma Etching of Ge-Doped Boron-Phosphosilicate Glass for Planar Lightwave Circuit Devices”,J. Non-Crystalline Solids, vol. 259, pp. 191-197 (1999).
U.S. Appl. No. 09/741,414, filed Dec. 19, 2000, Donahue.
Ruano, et al. “Fabrication of Integrated Microanalytical Chambers and Channels for Biological Assays Using Flame Hydrolysis Deposition Glass”,Microelectronic Eng., vol. 46(1999), pp. 419-422.
Ruano, et al., “Lab-on-a-Chip Devices Fabricated Using Flame Hydrolysis Deposited Glass ”, Inst. Of Elec. Eng. (1999), pp. 12/1-12/6.
Andrews. M., “An Overview of Sol Gel Guest-Host Materials Chemistry for Optical Devices”, 2997 SPIE (1997), pp. 48-59.
Kobayashi, S., Recent Development on Silica Waveguide Technology for Integrated Optics, 2997 SPIE (1997), pp. 264-270.
Ding, et al., “Wavelet Structural Analysis of Silica Glasses Manufactured by Different Methods”,J. Non-Crystalline Sol. , vol. 222 (1997), pp. 50-58.
Beguin, et al., “Planar Optical Devices for Use in Multi-Wavelength Systems”, IEEE (1997), pp. 504-505.
Ojha, “Fabrication Technologies for Planar Waveguide WDM Components”, 3211 SPIE (Dec. 1996), pp. 612-621.
Chun, et al. “Birefringence Reduction in a High Boron-Doped Silica-on-Silicon Planar Optical Waveguide”,J. Korean Phys. Soc., vol. 29, No. 1 (Feb. 1996), pp. 140-142.
Li, et al. “Silica-Based Optical Integrated Circuits”,IEE Proc. Optoelectron, vol. 143, No. 5 (Oct. 1996), pp. 263-280.
Wu, et al., “Fabrication of High Concentration Rare-Earth-Doped Silica-Based Waveguide by MCVD Method”,IEEE Photonics Tech. Letters, vol. 7, No. 6 (Jun. 1995), pp. 655-657.
Sun, et al., “Light Coupling from Diode Lasers to Microlensed Silica Waveguides”, Conference on Optical Fiber Communication, vol. 8 (1995), pp. 228-229.
Sun, et al. “Silica Waveguide Circuits with Low Polarisation Dependence Fabricated on Silica Substrates”,Electronics Letters, vol. 30 (Nov. 24, 1994), pp. 2032-2034.
Tsukahara, et al., “Evaluation of Layered Structures for Micromachines by Means of Ultrasonic Micro-Spectroscopy”,1994 Ultrasonics Symposium(1994), pp. 1429-1432.
Sun, et al., “High Silica Waveguides on Alumina Substrates for Hybrid Optoelectronic Integration”,IEEE Photonics Tech. Letters, vol. 4, No. 6 (Jun. 1992), pp. 630-632.
Sun, et al., “Silica-Based Circular Cross-Sectioned Channel Waveguides”,IEEE Photonics Tech. Letters, vol. 3, No. 3 (Mar. 1991), pp. 238-240.
Ikunishi, et al., “A Study of Fabricating Silica Glass Waveguide by LP-CVD”, (1987) pp. 66-69.
Sun, et al., “1×N Splitters on Silica Substrates with Low Polarization Dependent Loss”, pp. 243-244.
Annex to Form PCT/ISA/206 for PCT/US01/47493, dated Sep. 17, 2002.
PCT Search Report dated Dec. 10, 2002 for PCT/US01/47493.
Communication pursuant to Article 96(2) EPC dated Oct. 6, 2004; Application No. 01 990 046.3.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Optical integrated circuits (ICs) does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Optical integrated circuits (ICs), we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Optical integrated circuits (ICs) will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3608077

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.