Optical inspection system for solder joints and inspection metho

Optics: measuring and testing – By configuration comparison – With comparison to master – desired shape – or reference voltage

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358101, 358106, 358107, 356237, G01B 1100, H04N 700

Patent

active

052473449

ABSTRACT:
The adequacy of the fillets (24, 26) by which the lead (22) is soldered to pad (18) on printed circuit board (16) is evaluated by providing low angle diffuse illumination from circular fluorescent lamp (34) and observing the image with a television camera (30). The electronic image information is digitized and analyzed to produce a signal corresponding to the adequacy of the fillets and thus the adequacy of the solder joint. Automatic inspection is achieved and the signal can be employed to translate the printed wiring board to a new position for automatic inspection of another solder joint.

REFERENCES:
patent: 4028728 (1977-06-01), Sharp
patent: 4595289 (1986-06-01), Feldman et al.
patent: 4677473 (1987-06-01), Okamoto et al.
patent: 4688939 (1987-08-01), Ray
patent: 4811410 (1989-03-01), Amir et al.

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