Optics: measuring and testing – By configuration comparison – With photosensitive film or plate
Patent
1996-07-12
1998-03-03
Evans, F. L.
Optics: measuring and testing
By configuration comparison
With photosensitive film or plate
25055928, G01B 1106
Patent
active
057241457
ABSTRACT:
An optical film thickness measurement method and film formation method uses a method of measuring the optical thickness of films by radiating a monitor light beam towards a substrate during the formation of a stack of films on the substrate and measuring the optical film thickness from extreme values in the resultant reflection intensity. This stack of films comprises a first film having a reflectance of at least 98% within a predetermined wavelength range and a second film formed on the first film and having an absorption coefficient of 1000 cm.sup.-1 or less within that predetermined wavelength range. The first film is measured by a first monitor light beam having a predetermined wavelength and the second film is measured by a second monitor light beam having a wavelength that differs from the predetermined wavelength range.
REFERENCES:
patent: 5410411 (1995-04-01), Uchida et al.
K. Bacher et al., "Molecular beam epitaxy growth of vertical cavity optical devices with in situ corrections," Jul. 21, 1992, pp. 1387-1389.
Kaneko Takeo
Kondo Takayuki
Mori Katsumi
Evans F. L.
Seiko Epson Corporation
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