Optical die-down quad flat non-leaded package

Details Optical die-down quad flat non-leaded package Optical die-down quad flat non-leaded package

2009-01-14

2010-06-15

Parekh, Nitin (Department: 2811)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C438S022000, C438S065000, C438S116000, C438S123000, C257SE21503

Reexamination Certificate

active

07736930

ABSTRACT:
An optical sensor package that includes an optical sensor die is mounted by flip chip interconnect onto a lead frame in a “die-down” orientation, that is, with the active side of the optical sensor die facing the lead frame. An opening is provided in the lead frame die paddle (pad), and light passes from outside the package through the opening in the lead frame die pad onto light collection elements on the active side of the chip.

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