Optical die-down quad flat non-leaded package

Details Optical die-down quad flat non-leaded package Optical die-down quad flat non-leaded package

2006-05-05

2009-02-24

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With window means

C257S100000, C257S434000, C257S666000, C257S778000, C257SE23062, C257S676000

Reexamination Certificate

active

07495325

ABSTRACT:
An optical sensor package that includes an optical sensor die is mounted by flip chip interconnect onto a lead frame in a “die-down” orientation, that is, with the active side of the optical sensor die facing the lead frame. An opening is provided in the lead frame die paddle (pad), and light passes from outside the package through the opening in the lead frame die pad onto light collection elements on the active side of the chip.

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patent: 2006/0016973 (2006-01-01), Yang et al.

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