Optic mask and manufacturing method of thin film transistor...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

Reexamination Certificate

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Details

C438S155000, C438S164000, C257SE21125, C257SE31041

Reexamination Certificate

active

07858450

ABSTRACT:
An optic mask for crystallizing amorphous silicon comprises a first slit region including a plurality of slits regularly arranged for defining incident region of laser beam, wherein the slits of the first slit region are formed to slope by a predetermined angle to the direction of transfer of the optic mask in crystallization process, and wherein the slits of the first slit region includes a first slit having a first length and a second slit having a second length which is longer than the first length.

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patent: 2001/0055830 (2001-12-01), Yoshimoto
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patent: 2004/0134417 (2004-07-01), Kim
patent: 2004/0161913 (2004-08-01), Kawasaki et al.
patent: 2004/0266078 (2004-12-01), Kim
patent: 1421935 (2003-06-01), None
patent: 1435813 (2003-08-01), None
patent: 1454332 (2003-11-01), None

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