Nonvolatile semiconductor memory and method of manufacturing...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S270000, C438S589000

Reexamination Certificate

active

07115474

ABSTRACT:
A trench region14is formed in a memory cell P-type well13. Two NAND-type memory cell units ND1and ND2are respectively formed along both side wall portions of this trench region14.A floating gate FG and a control gate CG in these NAND-type memory cell units ND1and ND2are formed self-aligningly without using memory cell units ND1and ND2is formed via an interlayer dielectric30. The bit line pitch of this bit line BL is set at 2 F. Hence, the size of a nonvolatile semiconductor memory can be reduced.

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