Nonplanar device with stress incorporation layer and method...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S758000

Reexamination Certificate

active

11173443

ABSTRACT:
A semiconductor device comprising a semiconductor body having a top surface and laterally opposite sidewalls is formed on an insulating substrate. A gate dielectric layer is formed on the top surface of the semiconductor body and on the laterally opposite sidewalls of the semiconductor body. A gate electrode is formed on the gate dielectric on the top surface of the semiconductor body and is formed adjacent to the gate dielectric on the laterally opposite sidewalls of the semiconductor body. A thin film is then formed adjacent to the semiconductor body wherein the thin film produces a stress in the semiconductor body.

REFERENCES:
patent: 4906589 (1990-03-01), Chao
patent: 5124777 (1992-06-01), Lee
patent: 5338959 (1994-08-01), Kim et al.
patent: 5346839 (1994-09-01), Sundaresan
patent: 5466621 (1995-11-01), Hisamoto et al.
patent: 5521859 (1996-05-01), Ema et al.
patent: 5545586 (1996-08-01), Koh et al.
patent: 5563077 (1996-10-01), Ha et al.
patent: 5578513 (1996-11-01), Maegawa
patent: 5658806 (1997-08-01), Lin et al.
patent: 5701016 (1997-12-01), Burroughs et al.
patent: 5716879 (1998-02-01), Choi et al.
patent: 5804848 (1998-09-01), Mukai
patent: 5827769 (1998-10-01), Aminzadeh et al.
patent: 5844278 (1998-12-01), Mizuno et al.
patent: 5888309 (1999-03-01), Yu
patent: 5899710 (1999-05-01), Mukai
patent: 5905285 (1999-05-01), Gardner et al.
patent: 6018176 (2000-01-01), Lim
patent: 6066869 (2000-05-01), Noble et al.
patent: 6163053 (2000-12-01), Kawashima
patent: 6252284 (2001-06-01), Muller et al.
patent: 6359311 (2002-03-01), Colinge et al.
patent: 6376317 (2002-04-01), Forbes et al.
patent: 6391782 (2002-05-01), Yu
patent: 6396108 (2002-05-01), Krivokapic et al.
patent: 6407442 (2002-06-01), Inoue et al.
patent: 6413802 (2002-07-01), Hu et al.
patent: 6413877 (2002-07-01), Annapragada
patent: 6459123 (2002-10-01), Enders et al.
patent: 6472258 (2002-10-01), Adkisson et al.
patent: 6475869 (2002-11-01), Yu
patent: 6475890 (2002-11-01), Yu
patent: 6483156 (2002-11-01), Adkission et al.
patent: 6525403 (2003-02-01), Inaba et al.
patent: 6562665 (2003-05-01), Yu
patent: 6583469 (2003-06-01), Fried et al.
patent: 6611029 (2003-08-01), Ahmed et al.
patent: 6630388 (2003-10-01), Sekigawa et al.
patent: 6635909 (2003-10-01), Clark et al.
patent: 6642090 (2003-11-01), Fried et al.
patent: 6645797 (2003-11-01), Buynoski et al.
patent: 6657259 (2003-12-01), Fried et al.
patent: 6680240 (2004-01-01), Maszara
patent: 6689650 (2004-02-01), Gambino et al.
patent: 6706571 (2004-03-01), Yu et al.
patent: 6709982 (2004-03-01), Buynoski et al.
patent: 6713396 (2004-03-01), Anthony
patent: 6716684 (2004-04-01), Krivokapic et al.
patent: 6716690 (2004-04-01), Wang et al.
patent: 6730964 (2004-05-01), Horiuchi
patent: 6756657 (2004-06-01), Zhang et al.
patent: 6764884 (2004-07-01), Yu et al.
patent: 6770516 (2004-08-01), Wu et al.
patent: 6774390 (2004-08-01), Sugiyama et al.
patent: 6790733 (2004-09-01), Natzle et al.
patent: 6794313 (2004-09-01), Chang
patent: 6798000 (2004-09-01), Luyken et al.
patent: 6800855 (2004-10-01), Dong et al.
patent: 6812075 (2004-11-01), Fried et al.
patent: 6815277 (2004-11-01), Fried et al.
patent: 6821834 (2004-11-01), Ando
patent: 6833588 (2004-12-01), Yu et al.
patent: 6835614 (2004-12-01), Hanafi et al.
patent: 6835618 (2004-12-01), Dakshina-Murthy et al.
patent: 6838322 (2005-01-01), Pham et al.
patent: 6855990 (2005-02-01), Yeo et al.
patent: 6858478 (2005-02-01), Chau et al.
patent: 6867433 (2005-03-01), Yeo et al.
patent: 6884154 (2005-04-01), Mizushima et al.
patent: 6921982 (2005-07-01), Joshi et al.
patent: 6974738 (2005-12-01), Hareland et al.
patent: 2002/0011612 (2002-01-01), Hieda
patent: 2002/0036290 (2002-03-01), Inaba et al.
patent: 2002/0081794 (2002-06-01), Ito
patent: 2002/0166838 (2002-11-01), Nagarajan
patent: 2002/0167007 (2002-11-01), Yamazaki et al.
patent: 2003/0057486 (2003-03-01), Gambino et al.
patent: 2003/0085194 (2003-05-01), Hopkins, Jr.
patent: 2003/0098488 (2003-05-01), O'Keeffe et al.
patent: 2003/0102497 (2003-06-01), Fried et al.
patent: 2003/0111686 (2003-06-01), Nowak
patent: 2003/0122186 (2003-07-01), Sekigawa et al.
patent: 2003/0143791 (2003-07-01), Cheong et al.
patent: 2003/0151077 (2003-08-01), Mathew et al.
patent: 2003/0201458 (2003-10-01), Clark et al.
patent: 2003/0227036 (2003-12-01), Sugiyama et al.
patent: 2004/0031979 (2004-02-01), Lochtefeld et al.
patent: 2004/0036118 (2004-02-01), Adadeer et al.
patent: 2004/0036127 (2004-02-01), Chau et al.
patent: 2004/0092062 (2004-05-01), Ahmed et al.
patent: 2004/0092067 (2004-05-01), Hanafi et al.
patent: 2004/0094807 (2004-05-01), Chau et al.
patent: 2004/0099903 (2004-05-01), Yeo et al.
patent: 2004/0110097 (2004-06-01), Ahmed et al.
patent: 2004/0119100 (2004-06-01), Nowak et al.
patent: 2004/0126975 (2004-07-01), Ahmed et al.
patent: 2004/0166642 (2004-08-01), Chen et al.
patent: 2004/0180491 (2004-09-01), Arai et al.
patent: 2004/0191980 (2004-09-01), Rios et al.
patent: 2004/0195624 (2004-10-01), Liu et al.
patent: 2004/0198003 (2004-10-01), Yeo et al.
patent: 2004/0217420 (2004-11-01), Yeo et al.
patent: 2004/0219780 (2004-11-01), Ohuchi
patent: 2004/0227187 (2004-11-01), Cheng et al.
patent: 2004/0238887 (2004-12-01), Nihey
patent: 2004/0256647 (2004-12-01), Lee et al.
patent: 2004/0262683 (2004-12-01), Bohr et al.
patent: 2004/0262699 (2004-12-01), Rios et al.
patent: 2005/0035415 (2005-02-01), Yeo et al.
patent: 2005/0118790 (2005-06-01), Lee et al.
patent: 2005/0127362 (2005-06-01), Zhang et al.
patent: 2005/0145941 (2005-07-01), Bedell et al.
patent: 2005/0156171 (2005-07-01), Brask et al.
patent: 2005/0224797 (2005-10-01), Ko et al.
patent: 2005/0224800 (2005-10-01), Lindert
patent: 0 623 963 (1994-11-01), None
patent: 1 202 335 (2002-05-01), None
patent: 1 566 844 (2005-08-01), None
patent: 06177089 (1994-06-01), None
patent: 2003298051 (2003-10-01), None
patent: WO 02/43151 (2002-05-01), None
patent: WO 2004/059726 (2004-07-01), None
PCT International Search Report PCT/US2005/020339, mailed Oct. 4, 2005.
International Search Report PCT/US2005/033439, mailed Jan. 31, 2006 (7 pgs).
International Search Report PCT/US2005/035380, mailed Feb. 13, 2006 (14 pgs).
International Search Report PCT/US2005/037169, mailed Feb. 23, 2006 (14 pgs).
Sung Min Kim, et al., A Novel Multi-channel Field Effect Transistr (McFET) on Bulk Si for High Performance Sub-80nm Application, IEDM 04-639, 2004 IEEE, pp. 27.4.1-27.4.4.
Yang-Kyu Choi, et al., “A Spacer Patterning Technology for Nanoscale CMOS” IEEE Transactions on Electron Devices, vol. 49, No. 3, Mar. 2002, pp. 436-441.
W. Xiong, et al., “Corner Effect in Multiple-Gate SOI MOSFETs” 2003 IEEE, pp. 111-113.
Weize Xiong, et al., “Improvement of FinFET Electrical Characteristics by Hydrogen Annealing” IEEE Electron Device Letters, vol. 25, No. 8, Aug. 2004, XP-001198998, pp. 541-543.
Fu-Liang Yang, et al., “5nm-Gate Nanowire FinFET” 2004 Symposium on VLSI Technology Digest of Technical Papers, 2004 IEEE, pp. 196-197.
T. M. Mayer, et al., “Chemical Vapor Deposition of Fluoroalkylsilane Monolayer Films for Adhesion Control in Microelectromechanical Systems” 2000 American Vacuum Society B 18(5), Sep./Oct. 2000, pp. 2433-2440.
B. Jin et al., “Mobility Enhancement in Compressively Strained SiGe Surface Channel PMOS Transistors with Hf02/TiN Gate Stack”, Proceedings of the First Joint International Symposium, 206th Meeting of Electrochemical Society, Oct. 2004, pp. 111-122.
R. Chau, “Advanced Metal Gate/High-K Dielectric Stacks for High-Performance CMOS Transistors”, Proceedings of AVS 5th International Conference of Microelectronics and Interfaces, Mar. 2004, (3 pgs).
T. Park et al., “Fabrication of Body-Tied FinFETs (Omega MOSFETs) Using Bulk Si Wafers”, 2003 Symposium on VLSI Technology Digest of Technical Papers, pp. 135-136, Jun. 2003.
PCT Notification of Transmittal of The International Search Report and The Written Opinion of the International Searching Authority, or The Declaration for PCT Counterpart Applic

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Nonplanar device with stress incorporation layer and method... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Nonplanar device with stress incorporation layer and method..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Nonplanar device with stress incorporation layer and method... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3724272

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.