Non-volatile two transistor semiconductor memory cell and...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S257000, C438S258000, C438S263000, C438S266000, C438S201000, C438S211000, C438S594000, C257S239000, C257S261000, C257S314000, C257S323000, C257S315000, C257S316000, C257S317000

Reexamination Certificate

active

07018898

ABSTRACT:
The invention relates to a nonvolatile two-transistor semiconductor memory cell and an associated fabrication method, source and drain regions (2) for a selection transistor (AT) and a memory transistor (ST) being formed in a substrate (1). The memory transistor (ST) has a first insulation layer (3), a charge storage layer (4), a second insulation layer (5) and a memory transistor control layer (6), while the selection transistor (AT) has a first insulation layer (3′) and a selection transistor control layer (4*). By using different materials for the charge storage layer (4) and the selection transistor control layer (4*), it is possible to significantly improve the charge retention properties of the memory cell by adapting the substrate doping with electrical properties remaining the same.

REFERENCES:
patent: 4816883 (1989-03-01), Baldi
patent: 5081054 (1992-01-01), Wu et al.
patent: 5321287 (1994-06-01), Uemura et al.
patent: 5801414 (1998-09-01), Shinmori
patent: 6316317 (2001-11-01), Kawata et al.
patent: 6579762 (2003-06-01), Io
patent: 1 102 319 (2001-05-01), None
patent: 03177065 (1991-08-01), None

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