Non-volatile semiconductor memory device and method for manufact

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

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257371, 257548, 257324, H01L 29788

Patent

active

055148891

ABSTRACT:
An EEPROM device in which a high voltage is applied to the chip during the memory cell operation and a method for the manufacturing the same are disclosed. On a P-type semiconductor substrate, a first N-well is formed in a surface portion of the substrate in the cell array region and a second N-well is formed in a first surface of the substrate in the peripheral circuit region. An EEPROM memory cell is formed on the first P-well and a first NMOS transistor is formed on the second P-well. Also, a second NMOS transistor is formed on a second surface portion of the semiconductor substrate in the peripheral circuit 10 region and a PMOS transistor is formed on the second N-well. The impurity concentrations of the first and second P-wells are controlled in accordance with the characteristic of the MOS transistors to be formed. Further, a second NMOS transistor having a resistance against a high voltage is directly formed on the P-type substrate. Thus, the electric characteristic of the EEPROM device is enhanced.

REFERENCES:
patent: 4907058 (1990-03-01), Sakai
patent: 5063431 (1991-11-01), Ohshima
patent: 5341342 (1994-08-01), Brahmbhatt

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