Non-volatile flash memory device having at least two...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S289000, C257SE21423

Reexamination Certificate

active

11097281

ABSTRACT:
In a non-volatile flash memory device, and a method of fabricating the same, the device includes a semiconductor substrate, a source region and a drain region disposed in the semiconductor substrate to be spaced apart from each other, a tunneling layer pattern, a charge trap layer pattern and a shielding layer pattern, which are sequentially stacked on the semiconductor substrate between the source region and the drain region, adjacent to the source region, a first channel region disposed in the semiconductor substrate below the tunneling layer pattern, a gate insulating layer disposed on the semiconductor substrate between the drain region and the first channel region, a second channel region disposed in the semiconductor substrate below the gate insulating layer, a concentration of the second channel region being different from that of the first channel region, and a gate electrode covering the shielding layer pattern and the gate insulating layer.

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Chen Chun, et al., *, IEEE Transactions on Electron Devices, 45(7):1524-1530, (Jul. 1998).
Entitled: “Analysis of Enhanced Hot-Carrier Effects in Scaled Flash Memory Devices” P.

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